| Layer / Ratio / Statistic | TTM | PY1 | PY2 | |
|---|---|---|---|---|
| Overall Composite Score | 16.6 | 23.6 | 21.1 | |
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Income Statement Composite | 5.5 | 6.9 | 6.5 |
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↳ 3-Year Revenue CAGR | |||
| ↳ Capped Z-Score | 0.07 | — | — | |
| ↳ Sector Median Analytics | ||||
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↳ Gross Margin | |||
| ↳ Capped Z-Score | 1.04 | 1.17 | 1.22 | |
| ↳ Sector Median Analytics | ||||
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↳ Operating Margin | |||
| ↳ Capped Z-Score | 1.03 | 1.50 | 1.42 | |
| ↳ Sector Median Analytics | ||||
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↳ Net Profit Margin | |||
| ↳ Capped Z-Score | 0.98 | 1.76 | 1.37 | |
| ↳ Sector Median Analytics | ||||
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Cash Flow Composite | 3.3 | 3.3 | 2.9 |
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↳ 3-Year OCF CAGR | |||
| ↳ Capped Z-Score | -0.94 | — | — | |
| ↳ Sector Median Analytics | ||||
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↳ Operating Cash Flow Margin | |||
| ↳ Capped Z-Score | 0.85 | 1.03 | 0.76 | |
| ↳ Sector Median Analytics | ||||
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↳ Free Cash Flow Margin | |||
| ↳ Capped Z-Score | 1.38 | 1.25 | 1.12 | |
| ↳ Sector Median Analytics | ||||
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Balance Sheet Composite | 7.9 | 13.4 | 11.8 |
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↳ Return on Assets | |||
| ↳ Capped Z-Score | 0.93 | 1.49 | 2.20 | |
| ↳ Sector Median Analytics | ||||
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↳ Capital Intensity Ratio | |||
| ↳ Capped Z-Score | 0.90 | -0.28 | -0.37 | |
| ↳ Sector Median Analytics | ||||
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↳ Asset Turnover | |||
| ↳ Capped Z-Score | -0.08 | -0.25 | 0.48 | |
| ↳ Sector Median Analytics | ||||
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↳ Equity Multiplier | |||
| ↳ Capped Z-Score | 0.53 | 2.13 | -0.01 | |
| ↳ Sector Median Analytics | ||||
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↳ Return on Equity | |||
| ↳ Capped Z-Score | 1.16 | 3.05 | 1.98 | |
| ↳ Sector Median Analytics | ||||
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↳ Return on Invested Capital (ROIC) | |||
| ↳ Capped Z-Score | 1.42 | 1.87 | 1.93 | |
| ↳ Sector Median Analytics |
| Metric/Statistic | Ticker Value | |
|---|---|---|
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Market Valuation Composite | -9.4 |
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↳ Trailing P/E
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| ↳ Sector Median | ||
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↳ Forward P/E
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| ↳ Sector Median | ||
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↳ PEG Ratio
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| ↳ Sector Median | ||
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↳ EV/EBITDA
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| ↳ Sector Median | ||
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↳ EV/Revenue
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| ↳ Sector Median | ||
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↳ Potential Upside/(Downside) - Street Estimate
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| ↳ Sector Median | ||
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Relative (Discount)/ Premium - Operations
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↳ Actual Enterprise Value/Invested Capital:
↳ Predicted EV/Invested Capital:
↳ Fundamental Surplus:
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Implied FCFF Growth Rate
CURRENT
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↳ Weighted Historic FCFF Growth:
↳ Sector Median FCFF Growth:
↳ FCFF Growth Surplus:
i
↳ FCFF Growth Surplus z-score:
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Implied FCFE Growth Rate
CURRENT
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↳ Weighted Historic FCFE Growth:
↳ Sector Median FCFE Growth:
↳ FCFE Growth Surplus:
i
↳ FCFE Growth Surplus z-score:
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WACC
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↳ Cost/Weight of Equity:
↳ Cost/Weight of Debt:
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BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries in the Netherlands, Switzerland, Austria, Singapore, Malaysia, and internationally. It operates through three segments: Die Attach, Packaging, and Plating. The company offers single chip, multi chip, multi module, flip chip, epoxy and soft solder die bonding systems, hybrid, TCB and embedded bridge die bonding, die lid attach, and fan out wafer level packaging systems; and conventional, ultra-thin and wafer level molding, trim and form, and singulation systems. It also provides tin, copper, precious metal and solar plating systems, and related process chemicals; and tooling, conversion kits, spare parts, and other services. The company sells its products under the Fico, Meco, Datacon, and Esec brands. It serves multinational chip manufacturers, foundries, assembly subcontractors and electronics, and industrial companies. BE Semiconductor Industries N.V. was incorporated in 1995 and is headquartered in Duiven, the Netherlands.